E-beam Evaporator, Electron Beam Evaporator, UHV evaporator, MBE, EBV 40A1, rod and crucible evaporation, wetted wire cage, Oxford, EFM, k-cell, effusion cell, rod and crucible evaporation, Elektronenstrahlverdampfer, beam flux monitor, thermocouple

E-Beam Evaporator EBV 40A1

The EBV 40A1 is designed for thin film growth and molecular beam epitaxy. Sub-monolayer and multilayer systems can be produced with evaporation rates varying from 1/10 monolayer per minute to over 1000 monolayers per second. Water-cooling ensures low background pressure (typically in the 10-10 mbar range) during evaporation - and thus enables the growth of ultra-pure films. The precisely defined evaporant beam allows to obtain highly uniform deposition on the sample. The deposition area is determined by distance from the source to the sample and the choosing of one of the easy exchangeable exit.

E-beam Evaporator

Product Description:

Electron Evaporator mounted on DN 40CF flange, fully UHV-compatible, W/Th-filament for evaporation of rod material or from small conductable crucibles
Power of 50 W for high vapor pressure materials and up to 200 W for crucibles and thick wires
Evaporation of W, Ta, Mo, C, Pt, Cr, Ti, Fe, etc. from wire and Ag, Au, Al, Ni, etc. from crucibles or wetted wire cages
Deposition rate ca. 2 nm/min. for high temperature materials and 15-20 nm/min for high vapor pressure materials at 100 mm working distance
Wire feed 25 mm
Excellent water cooling by multiple water channels
Knudsen cell type crucible made from stainless steel
Flux regulation via ion current incl. electrode, feedthrough, display unit and PID-regulator
Integrated manual or electro-pneumatic shutter
Rear-loading evaporant
Electron Beam Evaporator Power Supply EBV-PS40
Linear Shift (optional)

Electron Beam Evaporator Schematic

Specifications:

	Diameter of beam for evaporated material:	4 - 15 mm depending on distance between end of the evaporator and a sample
	Distance between end of the evaporator and a sample:	Approximately 70 - 75 mm
	Range of temperature for evaporated materials:	160 - 2300°C (3300°C – after changing of connector on molybdenum)
	Electron energy:	0 - 1500 eV (typically 600 - 800 eV), max emission current – 200 mA, max power – 300 W
	Range of the filament current:	Typically 1.8 - 2.2 A; max – 2.5 A
	Rod diameters:	0.5 - 2.3 mm
	Temperature monitor of the cooling cylinder:	0 - 100°C, temperature of water-cooled copper cylinder
	Cooling system:	Water flow > 0.5 l/min at temperature T = 30°C on the end Max pressure – 6 bar
	Insertion Depth:	min. 190 mm, OD: 35 mm
	Mounting Flange:	DN 40CF
	Evaporation Area:	Ø 5 - 20 mm
	Bakeout Temperature:	up to 250°C

ELECTRON BEAM EVAPORATOR POWER SUPPLY EBV-PS40A

A key feature of EBV40A is the integrated flux monitor. The flux of the material is measured directly through the current of the produced ions. This allows an accurate flux adjustment and much faster rate control. The beam exit column contains the ion collector which is used as a flux monitor. At a given electron emission current and beam energy the ion flux measured there is directly proportional to the evaporated atoms flux.

The EBV-PS40A is equipped with PID temperature controller which stabilizes Ion Flux at desired level. User can work in AUTO mode (with Flux Ion Control) or MANUAL mode (without Flux Ion Control).

Evaporating process can be controlled (optional) by the computer through the RS-232 or RS-485 communication interface, and dedicated application.

Specifications:

	Beam Energy:	0 – 1500 eV at max 200mA; Error < 1V; Ripple < 0.5 Vpp
	Filament current:	0 - 2.5A ; typically 1.8 2.2 A; Error < 0.1A; Ripple < 0.05A
	Flux Ion Current Monitor:	10nA – 100mA in the 8 ranges; 1% accuracy for each range
	Temperature Monitor:	0 - 100°C, temperature of water-cooled copper cylinder
	Flux Current Regulator:	Flux current control with PID Controller
	Communication Interfaces (option):	EIA-232, 2 wire EIA-485, 4 wire EIA-485
	Dimensions (W x H x D):	483 x 133 x 350 mm

The EBV-PS40A is mounted in the 19” rack (full-width, 3 units height) or free standing.

SPECS Technologies Corporation
3318 Plantation Dr.
Sarasota, Florida 34231
Phone: (941) 362-4877
Fax: (941) 364-9706
support@specs.com